We won the Best Pitch Award in the Energy Category at ChangeNOW.
U-MAP is tackling one of the most critical bottlenecks in modern electronics: heat.
U-MAP develops advanced thermal management materials that combine:
• high thermal conductivity
• electrical insulation
• mechanical robustness
This enables more reliable, compact, and energy-efficient cooling solutions for semiconductors, power electronics, batteries, EVs, and data centers.
As electrification accelerates, thermal management is becoming a strategic challenge for the next generation of technologies.
If you believe we needs better solutions for energy and electronics, your vote would mean a lot to us.
Thank you for your support.
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